| 1. |
Mercury in compact fluorescent
lamps not exceeding 5 mg per lamp |
| |
|
| 2. |
Mercury in straight fluorescent
lamps for general purposes not exceeding: |
| |
- Halophosphate 10 mg
- Triphosphate with normal lifetime 5
mg
- Triphosphate with long lifetime 8 mg |
| |
|
| 3. |
Mercury in straight fluorescent
lamps for special purposes |
| |
|
| 4. |
Mercury in other lamps not
specifically mentioned in this Annex |
| |
|
| 5. |
Lead in glass of cathode ray
tubes, electronic components and fluorescent tubes |
| |
|
| 6. |
Lead as an alloying element in: |
| |
- Steel containing up to 0.35 %
lead by weight
- Aluminum containing up to 0.4 % lead by weight
- Copper alloy containing up to 4 % lead by weight |
| |
|
| 7. |
Lead in high melting temperature
type solders (i.e. lead-based alloys containing
85 % by weight or more lead) |
| |
- Lead in solders for servers,
storage and storage array systems, network
infrastructure
equipment for switching, signaling, transmission as
well as network management for
telecommunication.
- Lead in electronic ceramic parts (e.g.
Piezoelectronic devices). |
| |
|
| 8. |
Cadmium and its compounds in
electrical contacts and cadmium plating except for
applications
banned under Directive 91/338/EEC amending Directive
76/769/EEC relating to restrictions
on the marketing and use of certain dangerous
substances and preparations |
| |
|
| 9. |
Hexavalent chromium as an
anti-corrosion of the carbon steel cooling system in
absorption
refrigerators.
9b Lead in lead-bronze bearing shells and bushes |
| |
|
| 11. |
Lead used in compliant pin
connector systems |
| |
|
| 12. |
Lead as a coating material for
the thermal conduction module c-ring |
| |
|
| 13. |
Lead and cadmium in optical and
filter glass |
| |
|
| 14. |
Lead in solders consisting of
more than two elements for the connection between
the pins
and the package of microprocessors with a lead
content of more |
| |
|
| 15. |
Lead in solders to complete a
viable electrical connection between semiconductor
die
and carrier within integrated circuit Flip Chip
packages |
| |
|
| 16. |
Lead in linear incandescent lamps
with silicate coated tubes |
| |
|
| 17. |
Lead halide as radiant agent in
High Intensity Discharge (HID) lamps used for
professional reprography applications |
| |
|
| 18. |
Lead as activator in the
fluorescent powder (1 % lead by weight or less) of
discharge
lamps when used as sun tanning lamps containing
phosphors such asBSP (BaSi2O5:Pb) as
well as when used as speciality lamps for diazo-
printingreprography, lithography,
insect traps, photochemical and curing processes
containing phosphors such as SMS
((Sr,Ba)2MgSi2O7:Pb) |
| |
|
| 19. |
Lead with PbBiSn-Hg and PbInSn-Hg
in specific compositions as main amalgamand with
PbSn-Hg as auxiliary amalgam in very compact Energy
Saving Lamps(ESL) |
| |
|
| 20. |
Lead oxide in glass used for
bonding front and rear substrates of flat
fluorescent lamps
used for Liquid Crystal Displays (LCD) |
| |
|
| 21. |
Lead and cadmium in printing inks
for the application of enamels onborosilicate glass |
| |
|
| 22. |
Lead as impurity in RIG (rare
earth iron garnet) Faraday rotators used for fibre
optic
communications systems |
| |
|
| 23. |
Lead in finishes of fine pitch
components other than connectors with a pitch of
0.65 mm or less with NiFe lead frames and lead in
finishes of fine pitch components other
than connectors with a pitch of 0.65 mm or less with
copper lead frames |
| |
|
| 24. |
Lead in solders for the soldering
to machined through hole discoidal and planar array
ceramic multilayer capacitors |
| |
|
| 25. |
Lead oxide in plasma display
panels (PDP) and surface conduction electron emitter
displays(SED) used in structural elements; notably
in the front and rear glass dielectric layer,
the bus electrode, the black stripe, the address
electrode, the barrier ribs, the seal frit and frit
ring as well as in print pastes |
| |
|
| 26. |
Lead oxide in the glass envelope
of Black Light Blue (BLB) lamps |
| |
|
| 27. |
Lead alloys as solder for
transducers used in high-powered (designated to
operate for several hours at acoustic power levels
of 125 dB SPL and above) loudspeakers |
| |
|
| 29. |
Lead bound in crystal glass as
defined in Annex I (Categories1, 2, 3 and 4) of
Council
Directive 69/493/EEC (*). |
| |
|
| 30. |
Cadmium alloys as
electrical/mechanical solder joints to electrical
conductors located
directly on the voice coil in transducers used in
high-powered loudspeakers with sound
pressure levels of 100 dB (A) and more |
| |
|
| 31. |
Lead in soldering materials in
mercury free flat fluorescent lamps (which e.g. are
used
for liquid crystal displays, design or industrial
lighting) |
| |
|
| 32. |
Lead oxide in seal frit used for
making window assemblies for Argon and Krypton laser
tubes |
| |
|
| 33. |
Lead in solders for the soldering
of thin copper wires of 100 μm diameter and less in
power
transformers |
| |
|
| 34. |
Lead in cermet-based trimmer
potentiometer elements |
| |
|
| 35. |
Cadmium in photoresistance for
photocoupler applied in professional audio equipment
until
31 December 2009 |
| |
|
| 36. |
Mercury used as a cathode
sputtering inhibitor in DC plasma displays with a
content up to
30 mg per display until 1 July 2010 |
| |
|
| 37. |
Lead in the plating layer of high
voltage diodes on the basis of a zinc borate glass
body |
| |
|
| 38. |
Cadmium and cadmium oxide in
thick film pastes used on aluminium bonded beryllium
oxide |
