So far some Lead-free equipments have been put into use, including Compact High-speed Mounter (XP-143E, FUJI in Japan), the 1809EXL -- Heller's newest generation of re-flow ovens, the Double Wave Soldering Machine (TWL-300CSNP) which help to fulfill our target– having our own products, PCBA, OEM/ODM products lead-free by July 1 2006.

Compact High-speed Mounter (XP-143E, FUJI in Japan) Dimension:1500 x 1300 x 1408.5mm Applicable Components:up to 100 types Accuracy:+/- 0.05mm Speed:0.165 sec./pc Component Size:01005 min., 25*20mm max.

New Reflow Oven
- High speed, high-volume throughput at speeds up to 40 inches per minute
- Conserving valuable factory floor space
- Rapid response times and precise temperature controls
- User-friendly Windows TM software
- Single or dual-rail edge hold conveyor for greater versatility in board handling
- The most efficient heat transfer, from extra high-volume, high-velocity, heating modules,

   producing temperature gradients of less than 2℃ throughout the oven

Heating zone: 18
cooling zone:2
Weight:1588 kg
Dimension:4650 x 1371 x 1600 mm

 

Double Wave Soldering Machine (TWL-300CSNP)

Main Features
- Streamlined design, transparent door for easy observation and maintenance
- Powerful PC-controlled operation, easy to use
- Adjustable rails for stable, accurate, synchronized operation
- Automatic spraying monitoring system
- Audible and visual alarm against breakdown

Power:28.5 kW Air Pressure:4 kgf/cm2 Conveying speed:0.5 –2.2m/min PCB size:Max. 300mm x 400mm Weight:1680kg Dimension:4200mm (L) x 1410mm (W) x 1730mm (H)