Manufacturing Facilities

Compact High-speed Mounter (XP-143E, Fuji, Japan)
Lead-free Wave Soldering System (Twl-300CSNP, HK)
Ultra-Sonic Sealing Machine
Lead-free Hot-Air Reflow Oven (Heller, US)
Wave Soldering Machine (SPD-300, Japan)
High Frequency Welding Machine
Paste Printing Machine
Flux Sprayer (SP-300)
Pad Printing Machine
Welding Machine
Ultrasonic Cleaner
Emulator

Dispenser

Test Equipments

Temp & Humidity Chamber (Japan)
Signal Generator (low/high frequency)
Synchronized Distortion Device
Spectrum Analyzer (Germany)
Universal Programmer & Tester
Electro-acoustic Tester
Hi-Pot Tester
Decible Meter
Vibration Tester
Magnetometer
Digital Oscilloscope
Static Locator

Capabilities

Facotories:44,000 sq.ft.

Number of workers: 400-500
Pb Soldering, Lead free available
Varnish Application
Conformal Coating
Stamping Presses
Manual Assembly
Wire Bonding (sub-contracted)
Metal Parts (sub-contracted)
Injection Molding (sub-contracted)
Functional Testing
In Circuit Testing
Environmental Testing
Burn-in Testing
In-Process Testing
Hi-Pot Testing

SMT Process

SMT Assembly Line

Automatic Optical Inspection